Categories | Transistor Outline Package |
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Brand Name: | JOPTEC |
Place of Origin: | HEFEI, CHINA |
MOQ: | 50 PCS |
Payment Terms: | T/T |
Supply Ability: | 5000000 PCS/Month |
Delivery Time: | 30 Days |
Packaging Details: | Boxes |
Base material: | Low carbon steel, Kovar ceramic, tungsten copper |
Lead material: | Kovar, Kovar copper, copper alloy |
Thermal conductivity of base plate: | >150W/m.K |
Air tightness: | ≤1x10-3Pa.cm3/s (He) |
Plating: | Ni/Au |
Reliability: | Meets MIL-883 requirements |
Product name: TO and SMD type packages for transistor device
Applications: automatic control of machinery and electrical
appliances in the fields of home appliances, automobiles, ships,
motor cars, power electronics, etc.
Product characteristics: The external dimensions meet the JEDE
standard, and the glass or ceramic air-tight connection is used. It
is suitable for insertion and surface mounting. Parallel seam
welding or energy storage welding can be used for cover (cap)
sealing , the surface is nickel-plated and gold-plated,
differential plating areas, differential gold and nickel plating
thickness, good heat dissipation, good hermeticity and high
reliability.
Technical characteristics
Base material: Low carbon steel, Kovar ceramic, tungsten copper,
etc.
Lead material: Kovar, Kovar copper, copper alloy, etc.
Thermal conductivity of base plate: >150W/m.K
Air tightness: ≤1x10-3Pa.cm3/s (He)
Plating: Ni/Au
Reliability: Meets MIL-883 requirements
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