LIS3DHTR ST MEMS digital output motion sensor: ultra-low-power high-performance 3-axis "nano" accelerometer

LIS3DHTR ST Accelerometers MEMS Ultra Low-Power 3-Axes "Nano"

1.Features
Wide supply voltage, 1.71 V to 3.6 V
Independent IO supply (1.8 V) and supply voltage compatible
Ultra-low-power mode consumption down to 2 μA
2g/±4g/8g/16g dynamically selectable full scale
I2C/SPI digital output interface
16-bit data output
2 independent programmable interrupt generators for free-fall and motion detection
6D/4D orientation detection
Free-fall detection
Motion detection
Embedded temperature sensor
Embedded self-test
Embedded 32 levels of 16-bit data output FIFO
10000 g high shock survivabilityECOPACK®, RoHS and “Green” compliant

2.Applications
Motion activated functions
Free-fall detection
Click/double-click recognition
Intelligent power saving for handheld devices
Pedometers
Display orientation
Gaming and virtual reality input devices
Impact recognition and logging
Vibration monitoring and compensation

3.

Description
The LIS3DH is an ultra-low-power high-performance three-axis linear accelerometer belonging to the “nano” family, with digital I2C/SPI serial interface standard output. The device features ultra-low-power operational modes that allow advanced power saving and smart embedded functions.

The LIS3DH has dynamically user-selectable full scales of 2g/±4g/8g/16g and is capable of measuring accelerations with output data rates from 1 Hz to 5.3 kHz. The self-test capability allows the user to check the functioning of the sensor in the final application. The device may be configured to generate interrupt signals using two independent inertial wake-up/free-fall events as well as by the position of the device itself. Thresholds and timing of interrupt generators are programmable by the end user on the fly. The LIS3DH has an integrated 32-level first-in, first-out (FIFO) buffer allowing the user to store data in order to limit intervention by the host processor. The LIS3DH is available in small thin plastic land grid array package (LGA) and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C

4.Pin description

5.Application hints

Shenzhen Hongxinwei Technology Co., Ltd is located in the Bao’an District of Shenzhen.It is a high-tech enterprise setting research and development, production, sales into an integration. The company covers an area of 15 acres, having modern producing workshop and professional production and testing equipments. The company has an existing staff of more than 100 people.The company has set up offices in Shenzhen, Hongkong and Singapore providing worldwide service.