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Immersion Gold Double Sided High Temperature PCB For Automotive

Categories FR4 PCB Board
Brand Name: Bicheng
Model Number: BIC-507.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: FR-4 IT-180ATC
PCB thickness: 1.63-1.68mm
Copper weight: 1oz
Surface finish: Immersion gold
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Immersion Gold Double Sided High Temperature PCB For Automotive


High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold Double Sided High Temperature PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Brief Introduction

This is a standard double-sided high-temperature PCB manufactured on ITEQ's IT-180ATC laminate. The boards are arrayed in a 10-up panel configuration, featuring a 1.6mm thickness and 2oz copper weight. Key finishes include immersion gold on pads and green solder mask protection for the substrate. Units are vacuum-packed in quantities of 25 for secure shipment.


Applications

Automotive (Engine room ECU)

Backplanes

Data Storage

Server and Networking

Telecommunications



PCB Parameters

ItemDescriptionRequirementActualResult
1. LaminateMaterial TypeFR-4 IT-180ATCFR-4 IT-180ATCACC
Tg170℃170℃ACC
SupplierITEQITEQACC
Thickness1.6±10% mm1.63-1.68mmACC
2.Plating thicknessHole Wall≥25µm26.51µmACC
Outer copper35µm41.09µmACC
Inner Copper
3.Solder maskMaterial TypeTAIYO/ PSR-2000GT600DTAIYO/ PSR-2000GT600DACC
ColorGreenGreenACC
Rigidity (Pencil Test)≥4H or above5HACC
S/M Thickness≥10 µm20.11µmACC
LocationBoth SidesBoth SidesACC
4. Component MarkMaterial TypeTAIYO/ IJR-4000 MW300IJR-4000 MW300ACC
ColorWhiteWhiteACC
LocationC/SC/SACC
5. Peelable Solder MaskMaterial Type
Thickness
Location
6. IdentificationUL MarkYESYESACC
Date CodeWWYY2121ACC
Mark LocationSolder SideSolder SideACC
7. Surface FinishMethodImmersion GoldImmersion GoldACC
Tin Thickness
Nickel Thickness3-6µm4.06µmACC
Gold Thickness0.05µm0.056µmACC
8. NormativenessRoHSDirective 2015/863/EUOKACC
REACHDirective 1907 /2006OKACC
9.Annular RingMin. Line Width (mil)5mil4.8milACC
Min. Spacing (mil)5mil5.2milACC
10.V-grooveAngle30º30ºACC
Residual thickness0.4±0.1mm0.43mmACC
11. BevelingAngle
Height
12. FunctionElectrical Test100% PASS100% PASSACC
13. AppearanceIPC Class LevelIPC-A-600J &6012D Class 2IPC-A-600J &6012D Class 2ACC
Visual InspectionIPC-A-600J &6012D Class 2IPC-A-600J &6012D Class 2ACC
Warp and Twist≦0.7%0.21%ACC
14. Reliability TestTape TestNo PeelingOKACC
Solvent TestNo PeelingOKACC
Solderability Test265 ±5℃OKACC
Thermal Stress Test288 ±5℃OKACC
Ionic Contamination Test≦ 1.56 µg/c㎡0.56µg/c㎡ACC

Hole Diameter Measurement (Unit: mm),Tolerance: PTH±0.075; NPTH±0.05

Hole CodePTHRequiredActual valueResult
1Y0.4000.4000.4250.4250.400ACC
2Y0.4500.4500.5000.4750.450ACC
3Y0.6000.6000.6500.6250.600ACC
4Y0.7250.7500.7750.7750.750ACC
5Y0.8500.8500.8250.8500.825ACC


China Immersion Gold Double Sided High Temperature PCB For Automotive factory
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