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Application:FC package substrate,FlipChip substrate,Flipchip CSP,.FBGA/LGA/PBGA/WBGA substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm...
Application:FC package substrate,FlipChip substrate,Flipchip CSP,.FBGA/LGA/PBGA/WBGA substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm... more
Brand Name:Horexs
Model Number:HRX
Place of Origin:CHINA
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...Glass Wafers The Innovative and High-Performance Choice for Your Applications Available in Multiple Sizes Are you in pursuit of the ideal substrate for your high - precision projects? Look no further than our Alkaline - Free Glass Wafers. These wafers are ...
...Glass Wafers The Innovative and High-Performance Choice for Your Applications Available in Multiple Sizes Are you in pursuit of the ideal substrate for your high - precision projects? Look no further than our Alkaline - Free Glass Wafers. These wafers are ... more
Brand Name:CQT
Model Number:alkaline free glass
Place of Origin:China
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... of silicon semiconductor devices in a layered silicon–insulator–silicon substrate, to reduce parasitic capacitance within the device, thereby improving performance. SOI-based devices differ from conventional silicon-built devices in that the
... of silicon semiconductor devices in a layered silicon–insulator–silicon substrate, to reduce parasitic capacitance within the device, thereby improving performance. SOI-based devices differ from conventional silicon-built devices in that the more
Brand Name:ZMSH
Model Number:customized
Place of Origin:China
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...Wafer We provides MBE / MOCVD epitaxial growth of custom structure on GaAs substrate for microelectronics , optoelectronics and RF Microwave applications , in diameter Ø 3" to Ø 4” . With our extensive MOCVD experience , we can grow binary alloy ( LT-GaAs , AlAs ) or ternary alloy ( AlGaAs , InGaAs ,GaAsP , InGaP ) on GaAs substrate , singel layer or multiple...
...Wafer We provides MBE / MOCVD epitaxial growth of custom structure on GaAs substrate for microelectronics , optoelectronics and RF Microwave applications , in diameter Ø 3" to Ø 4” . With our extensive MOCVD experience , we can grow binary alloy ( LT-GaAs , AlAs ) or ternary alloy ( AlGaAs , InGaAs ,GaAsP , InGaP ) on GaAs substrate , singel layer or multiple... more
Brand Name:ZG
Model Number:MS
Place of Origin:CHINA
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...85°C - Flash memory type: NAND - Interface: SPI, QPI - Data retention: 10 years - Endurance: 100,000 program/erase cycles - Packaging: Wafer/Chip Scale Package (WSP/CSP) Applications: - Embedded systems - Automotive systems - Industrial systems - Mobile...
...85°C - Flash memory type: NAND - Interface: SPI, QPI - Data retention: 10 years - Endurance: 100,000 program/erase cycles - Packaging: Wafer/Chip Scale Package (WSP/CSP) Applications: - Embedded systems - Automotive systems - Industrial systems - Mobile... more
Brand Name:Winbond Electronics
Model Number:W25N01GWTBIT
Place of Origin:Multi-origin
