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XILINX XC6SLX16-2FTG256C BGA Embedded Processor Embedded Processor is a microprocessor that is designed to be integrated into a larger system, such as a computer or electronic device. It typically includes a range of components, such as a central ...
XILINX XC6SLX16-2FTG256C BGA Embedded Processor Embedded Processor is a microprocessor that is designed to be integrated into a larger system, such as a computer or electronic device. It typically includes a range of components, such as a central ... more
Brand Name:XILINX
Model Number:XC6SLX16-2FTG256C
Place of Origin:TW
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Product Description: The EMMC Memory Card is a high-performance storage solution designed to meet the demands of modern electronic devices such as phones, tablets, and other portable gadgets. Engineered with precision and reliability in mind, this EMMC ...
Product Description: The EMMC Memory Card is a high-performance storage solution designed to meet the demands of modern electronic devices such as phones, tablets, and other portable gadgets. Engineered with precision and reliability in mind, this EMMC ... more
Bus Width:1-bit, 4-bit, 8-bit
Product Completion:Standard
Capacity:8gb/ 16gb/ 32gb/ 64gb/ 128gb/ 256gb
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...BGA Assembly ♦ What Is BGA Assembly? BGA (Ball Grid Array) assembly is a surface-mount technology used in printed circuit board (PCB) manufacturing to mount integrated circuits (ICs) with high pin counts. Instead of traditional pins, BGAs use an array of tiny solder balls...
...BGA Assembly ♦ What Is BGA Assembly? BGA (Ball Grid Array) assembly is a surface-mount technology used in printed circuit board (PCB) manufacturing to mount integrated circuits (ICs) with high pin counts. Instead of traditional pins, BGAs use an array of tiny solder balls... more
Place of Origin:China
Certification:ISO, UL, IPC, Reach
Minimum Order Quantity:1
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...BGA Assembly – Fine-Pitch & Ball Grid Array Overview Ball Grid Array (BGA) components are at the heart of modern high-density electronics—enabling complex functionality in compact form factors. However, BGA assembly demands exceptional precision: solder joints are hidden beneath the component body, making visual inspection impossible and quality verification reliant on advanced X-Ray systems. Studio Electronics delivers Precision BGA
...BGA Assembly – Fine-Pitch & Ball Grid Array Overview Ball Grid Array (BGA) components are at the heart of modern high-density electronics—enabling complex functionality in compact form factors. However, BGA assembly demands exceptional precision: solder joints are hidden beneath the component body, making visual inspection impossible and quality verification reliant on advanced X-Ray systems. Studio Electronics delivers Precision BGA more
Place of Origin:China
Minimum Order Quantity:No MOQ
Supply Ability:100,000 pieces/month
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... footprint technologies. From standard FPGAs to complex Micro-BGAs (0.2mm pitch) and Package-on-Package (PoP) stacking, we possess the equipment and process maturity to ensure reliable interconnections. The challenge with BGA technology is visibility.
... footprint technologies. From standard FPGAs to complex Micro-BGAs (0.2mm pitch) and Package-on-Package (PoP) stacking, we possess the equipment and process maturity to ensure reliable interconnections. The challenge with BGA technology is visibility. more
Brand Name:Dux PCB
Model Number:BGA Assembly
Place of Origin:China
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... ) GL865-QUAD he new GE865 product family introduces the smallest GSM/GPRS Ball-Grid-Array (BGA) modules in the market. The low profile and small size of the unique BGA package for the GE865-QUAD enable the design of extremely compact applications. Since
... ) GL865-QUAD he new GE865 product family introduces the smallest GSM/GPRS Ball-Grid-Array (BGA) modules in the market. The low profile and small size of the unique BGA package for the GE865-QUAD enable the design of extremely compact applications. Since more
Brand Name:TELIT
Model Number:GL865-QUAD
Place of Origin:China
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...Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold (Printed circuits boards are custom-made products, the picture and parameters shown are just for reference) 1.1 General description This is a type of 10-layer printed circuit board built on FR-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A BGA...
...Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold (Printed circuits boards are custom-made products, the picture and parameters shown are just for reference) 1.1 General description This is a type of 10-layer printed circuit board built on FR-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A BGA... more
Brand Name:Bicheng
Model Number:BIC-462.V1.0
Place of Origin:CHINA
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...Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold (Printed circuits boards are custom-made products, the picture and parameters shown are just for reference) 1.1 General description This is a type of 10-layer printed circuit board built on FR-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A BGA...
...Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold (Printed circuits boards are custom-made products, the picture and parameters shown are just for reference) 1.1 General description This is a type of 10-layer printed circuit board built on FR-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A BGA... more
Brand Name:Bicheng Technologies Limited
Model Number:BIC-462-V7.8
Place of Origin:China
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PCBA Board Fabrication Ball Grid Array Bga Pcb Assembly Quick Turn prototype and mass production PCB FASTPCBA dedicated in manufacturing 1-48 layers quick turn prototype and mass production High precision PCBs with the principle of “the Best quality, the ...
PCBA Board Fabrication Ball Grid Array Bga Pcb Assembly Quick Turn prototype and mass production PCB FASTPCBA dedicated in manufacturing 1-48 layers quick turn prototype and mass production High precision PCBs with the principle of “the Best quality, the ... more
Brand Name:FASTPCBA
Model Number:Bga Pcb Assembly
Place of Origin:China
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OEM PCBA Aluminum PCB Prototyping Ball Grid Array FR4 Rapid PCBA Rapid PCBA Introduction Rapid PCBA is a short delivery method. Generally speaking, according to the number of components and inventory of the components on the PCBA to determine the delivery ...
OEM PCBA Aluminum PCB Prototyping Ball Grid Array FR4 Rapid PCBA Rapid PCBA Introduction Rapid PCBA is a short delivery method. Generally speaking, according to the number of components and inventory of the components on the PCBA to determine the delivery ... more
Brand Name:HNL-PCBA
Model Number:Rapid PCBA
Place of Origin:CHINA
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New Energy PCB Assembly with AOI,ICT,100% Visual Inspection,FT SMT Parameters: Technology Involved: Special Technology Involved ◆ IC Programming ◆ BGA rework ◆ Chip on Board/COB ◆ Eutectic soldering ◆ Auto-Gluing ◆ Conformal Coating Assemly Flow Chart: ...
New Energy PCB Assembly with AOI,ICT,100% Visual Inspection,FT SMT Parameters: Technology Involved: Special Technology Involved ◆ IC Programming ◆ BGA rework ◆ Chip on Board/COB ◆ Eutectic soldering ◆ Auto-Gluing ◆ Conformal Coating Assemly Flow Chart: ... more
Brand Name:Suntek
Model Number:FPA8569-NE4
Place of Origin:China
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HTF provides OEM electronics manufacturing with nitrogen reflow soldering for BGA PCBA assembly of BMS battery management system and battery charging applications on FR4, FR1-4, PI polyimide, copper, and aluminum base materials with 0.5-6OZ copper ...
HTF provides OEM electronics manufacturing with nitrogen reflow soldering for BGA PCBA assembly of BMS battery management system and battery charging applications on FR4, FR1-4, PI polyimide, copper, and aluminum base materials with 0.5-6OZ copper ... more
Brand Name:HTF
Place of Origin:Guangdong, China
Application:BMS Product OEM, Battery Charger OEM, IoT Embedded Systems, ...
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Instrumentation focuses on the development of master control system devices based on fieldbus technology and intelligent instruments, special and special automatic instruments; Expand the service field comprehensively, promote the digitization, ...
Instrumentation focuses on the development of master control system devices based on fieldbus technology and intelligent instruments, special and special automatic instruments; Expand the service field comprehensively, promote the digitization, ... more
Brand Name:FASTPCB
Place of Origin:CHINA
Minimum Order Quantity:10PCS
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Pcb Soldering Service Pcb Sourcing PCBA Aoi SMT PCBA Assembly Shenzhen Yideyi Technology Limited Company is a professional manufacturing enterprise majoring in high end and multi-layer Printed Circuit Board. Along with more than 10 years′ development, our...
Pcb Soldering Service Pcb Sourcing PCBA Aoi SMT PCBA Assembly Shenzhen Yideyi Technology Limited Company is a professional manufacturing enterprise majoring in high end and multi-layer Printed Circuit Board. Along with more than 10 years′ development, our... more
Brand Name:YDY
Model Number:E-002
Place of Origin:China
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...: unknown JESD - 30 : S - PBGA - B1357 code The number of terminals :1357 Packaging body material Plastic Encapsulate the code BGA Encapsulation equivalent code BGA1357,37X37,40 Packaging shape :SQUARE Encapsulated :Grid Array The power of: 1.2
...: unknown JESD - 30 : S - PBGA - B1357 code The number of terminals :1357 Packaging body material Plastic Encapsulate the code BGA Encapsulation equivalent code BGA1357,37X37,40 Packaging shape :SQUARE Encapsulated :Grid Array The power of: 1.2 more
Brand Name:INTEL
Model Number:WP81341M0820
Place of Origin:USA
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EP4CE40F23C8N IC FPGA 328 I/O 484FBGA Mfr Intel Series Cyclone® IV E Package Tray Product Status Active Number of LABs/CLBs 2475 Number of Logic Elements/Cells 39600 Total RAM Bits 1161216 Number of I/O 328 Voltage - Supply 1.15V ~ 1.25V Mounting Type ...
EP4CE40F23C8N IC FPGA 328 I/O 484FBGA Mfr Intel Series Cyclone® IV E Package Tray Product Status Active Number of LABs/CLBs 2475 Number of Logic Elements/Cells 39600 Total RAM Bits 1161216 Number of I/O 328 Voltage - Supply 1.15V ~ 1.25V Mounting Type ... more
Brand Name:Intel
Model Number:EP4CE40F23C8N
Minimum Order Quantity:1
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...Semi Automatic BGA Rework Station is a state-of-the-art solution designed for precision and efficiency in the delicate process of BGA (Ball Grid Array) component repair and rework. Engineered with advanced features and robust construction, this BGA Rework ...
...Semi Automatic BGA Rework Station is a state-of-the-art solution designed for precision and efficiency in the delicate process of BGA (Ball Grid Array) component repair and rework. Engineered with advanced features and robust construction, this BGA Rework ... more
Brand Name:Wisdomshow
Model Number:WDS-620
Delivery Time:3-5days
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BGA Rework Station for Mobile Phone CCD Color Optical Alignment System 0.01mm Mounting Accuracy 1℃ Temperature Accuracy Product Overview The Mobile Phone BGA (Ball Grid Array) Rework Station is a high-performance, professional-grade repair solution ...
BGA Rework Station for Mobile Phone CCD Color Optical Alignment System 0.01mm Mounting Accuracy 1℃ Temperature Accuracy Product Overview The Mobile Phone BGA (Ball Grid Array) Rework Station is a high-performance, professional-grade repair solution ... more
Brand Name:HSTECH
Model Number:HS-700
Place of Origin:China
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...permanently mount devices such as microprocessors. It can reduce package size and integrating a greater number of functions on a single chip module. BGA also replaces solder balls on the component underside for SMT mounting. The whole bottom surface of the
...permanently mount devices such as microprocessors. It can reduce package size and integrating a greater number of functions on a single chip module. BGA also replaces solder balls on the component underside for SMT mounting. The whole bottom surface of the more
Brand Name:Shinelink
Model Number:SL0925S01
Place of Origin:China
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...BGA (Wire Bond Ball Grid Array). BT resin, with its high glass transition temperature (180-225°C), low moisture absorption (0.3-0.5%), and fine-line capability (10/10 μm), enables high-density interconnection for memory controllers, RF modules, and mobile application processors. The substrate redistributes...
...BGA (Wire Bond Ball Grid Array). BT resin, with its high glass transition temperature (180-225°C), low moisture absorption (0.3-0.5%), and fine-line capability (10/10 μm), enables high-density interconnection for memory controllers, RF modules, and mobile application processors. The substrate redistributes... more
Brand Name:Jiaqing Circuit
Place of Origin:China
Payment Terms:L/C,D/A,D/P,T/T
