-
... holes on the motherboard socket. Unlike LGA (where the pins are on the motherboard), PGA is often used in embedded platforms, low-cost PCs, educational systems, and industrial control boards. Key advantages of the PGA socket: 1. Simple Structure &
... holes on the motherboard socket. Unlike LGA (where the pins are on the motherboard), PGA is often used in embedded platforms, low-cost PCs, educational systems, and industrial control boards. Key advantages of the PGA socket: 1. Simple Structure & more
Brand Name:Jrkconn
Model Number:PGA - 13 Series
Place of Origin:Guangdong, China
-
Precision BGA Assembly – Fine-Pitch & Ball Grid Array Overview Ball Grid Array (BGA) components are at the heart of modern high-density electronics—enabling complex functionality in compact form factors. However, BGA assembly ...
Precision BGA Assembly – Fine-Pitch & Ball Grid Array Overview Ball Grid Array (BGA) components are at the heart of modern high-density electronics—enabling complex functionality in compact form factors. However, BGA assembly ... more
Place of Origin:China
Minimum Order Quantity:No MOQ
Supply Ability:100,000 pieces/month
Fine Pitch BGA Assembly Precision Ball Grid Array Assembly High Density
-
... ) GL865-QUAD he new GE865 product family introduces the smallest GSM/GPRS Ball-Grid-Array (BGA) modules in the market. The low profile and small size of the unique BGA package for the GE865-QUAD enable the design of extremely ...
... ) GL865-QUAD he new GE865 product family introduces the smallest GSM/GPRS Ball-Grid-Array (BGA) modules in the market. The low profile and small size of the unique BGA package for the GE865-QUAD enable the design of extremely ... more
Brand Name:TELIT
Model Number:GL865-QUAD
Place of Origin:China
GL865-QUAD TELIT Smallest GSM/GPRS ball grid array module
-
...BGA (Ball Grid Array) assembly is a surface-mount technology used in printed circuit board (PCB) manufacturing to mount integrated circuits (ICs) with high pin counts. Instead of traditional pins, BGAs use an array of tiny solder balls underneath...
...BGA (Ball Grid Array) assembly is a surface-mount technology used in printed circuit board (PCB) manufacturing to mount integrated circuits (ICs) with high pin counts. Instead of traditional pins, BGAs use an array of tiny solder balls underneath... more
Place of Origin:China
Certification:ISO, UL, IPC, Reach
Minimum Order Quantity:1
Medical Prototype PCB Motherboard Assembly Ball Grid Array BGA Customized
-
PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold (Printed circuits boards are custom-made products, the ...
-
BGA PCB Assembly Services Micro-BGA, PoP, and Fine-Pitch Assembly with Zero-Defect Assurance DuxPCB delivers high-end Ball Grid Array (BGA) assembly services, specializing in the most challenging footprint technologies. From standard FPGAs to complex Micro...
BGA PCB Assembly Services Micro-BGA, PoP, and Fine-Pitch Assembly with Zero-Defect Assurance DuxPCB delivers high-end Ball Grid Array (BGA) assembly services, specializing in the most challenging footprint technologies. From standard FPGAs to complex Micro... more
Brand Name:Dux PCB
Model Number:BGA Assembly
Place of Origin:China
BGA PCB Assembly Services , High End Ball Grid Array Assembly
-
PCBA Board Fabrication Ball Grid Array Bga Pcb Assembly Quick Turn prototype and mass production PCB FASTPCBA dedicated in manufacturing 1-48 layers quick turn prototype and mass production High precision PCBs with the principle of “the Best quality, the ...
PCBA Board Fabrication Ball Grid Array Bga Pcb Assembly Quick Turn prototype and mass production PCB FASTPCBA dedicated in manufacturing 1-48 layers quick turn prototype and mass production High precision PCBs with the principle of “the Best quality, the ... more
Brand Name:FASTPCBA
Model Number:Bga Pcb Assembly
Place of Origin:China
PCBA Board Fabrication Ball Grid Array Bga Pcb Assembly
-
PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold (Printed circuits boards are custom-made products, the ...
-
OEM PCBA Aluminum PCB Prototyping Ball Grid Array FR4 Rapid PCBA Rapid PCBA Introduction Rapid PCBA is a short delivery method. Generally speaking, according to the number of components and inventory of the components on the PCBA to determine the delivery ...
OEM PCBA Aluminum PCB Prototyping Ball Grid Array FR4 Rapid PCBA Rapid PCBA Introduction Rapid PCBA is a short delivery method. Generally speaking, according to the number of components and inventory of the components on the PCBA to determine the delivery ... more
Brand Name:HNL-PCBA
Model Number:Rapid PCBA
Place of Origin:CHINA
Aluminum PCB Prototyping FR4 Rapid PCBA Ball Grid Array Assembly
-
New Energy PCB Assembly with AOI,ICT,100% Visual Inspection,FT SMT Parameters: Technology Involved: Special Technology Involved ◆ IC Programming ◆ BGA rework ◆ Chip on Board/COB ◆ Eutectic soldering ◆ Auto-Gluing ◆ Conformal Coating Assemly Flow Chart: ...
New Energy PCB Assembly with AOI,ICT,100% Visual Inspection,FT SMT Parameters: Technology Involved: Special Technology Involved ◆ IC Programming ◆ BGA rework ◆ Chip on Board/COB ◆ Eutectic soldering ◆ Auto-Gluing ◆ Conformal Coating Assemly Flow Chart: ... more
Brand Name:Suntek
Model Number:FPA8569-NE4
Place of Origin:China
Ball Grid Array Bom Pcb Assembly With AOI ICT 100% Visual Inspection
-
HTF provides OEM electronics manufacturing with nitrogen reflow soldering for BGA PCBA assembly of BMS battery management system and battery charging applications on FR4, FR1-4, PI polyimide, copper, and aluminum base materials with 0.5-6OZ copper ...
HTF provides OEM electronics manufacturing with nitrogen reflow soldering for BGA PCBA assembly of BMS battery management system and battery charging applications on FR4, FR1-4, PI polyimide, copper, and aluminum base materials with 0.5-6OZ copper ... more
Brand Name:HTF
Place of Origin:Guangdong, China
Application:BMS Product OEM, Battery Charger OEM, IoT Embedded Systems, ...
Nitrogen Reflow HDI PCB Assembly Ball Grid Array SMD PCB Assembly Turnkey
-
Pcb Soldering Service Pcb Sourcing PCBA Aoi SMT PCBA Assembly Shenzhen Yideyi Technology Limited Company is a professional manufacturing enterprise majoring in high end and multi-layer Printed Circuit Board. Along with more than 10 years′ development, our...
-
Instrumentation focuses on the development of master control system devices based on fieldbus technology and intelligent instruments, special and special automatic instruments; Expand the service field comprehensively, promote the digitization, ...
-
XILINX XC6SLX16-2FTG256C BGA Embedded Processor Embedded Processor is a microprocessor that is designed to be integrated into a larger system, such as a computer or electronic device. It typically includes a range of components, such as a central ...
XILINX XC6SLX16-2FTG256C BGA Embedded Processor Embedded Processor is a microprocessor that is designed to be integrated into a larger system, such as a computer or electronic device. It typically includes a range of components, such as a central ... more
Brand Name:XILINX
Model Number:XC6SLX16-2FTG256C
Place of Origin:TW
XILINX XC6SLX16-2FTG256C Bga Ball Grid Array Processor Embedded
-
Product Description: The EMMC Memory Card is a high-performance storage solution designed to meet the demands of modern electronic devices such as phones, tablets, and other portable gadgets. Engineered with precision and reliability in mind, this EMMC ...
-
SEAF-50-01-L-06-2-RA-GP-K-TR Connectors 1.27mm Pitch Open-Pin-Field Array Socket Connectors [MJD Advantage] + 15 years experience for electronic components + Secure Ordering + Excellent Feedback + Delivery Date Guaranteed + ...
-
...Sockets Product Overview 3M Textool BGA Test & Burn-In Sockets, with a 1.00 mm pitch, are designed for reliable testing and burn-in applications of Ball Grid Array (BGA) devices. These open-top sockets feature a double-beam, normally-closed contact design that provides balanced, opposing forces to the solder ball, minimizing shear stress and producing only slight indentations with minimal ball...
...Sockets Product Overview 3M Textool BGA Test & Burn-In Sockets, with a 1.00 mm pitch, are designed for reliable testing and burn-in applications of Ball Grid Array (BGA) devices. These open-top sockets feature a double-beam, normally-closed contact design that provides balanced, opposing forces to the solder ball, minimizing shear stress and producing only slight indentations with minimal ball... more
Model Number:2256-9357-0A-2401
Number of Positions:-
Adaptation Package Type:-
Durable 3M 2256-9357-0A-2401 BGA Burn-In Socket with Excellent Airflow and Balanced Contact Forces
-
...Connectors, Interconnects Sockets for ICs, Transistors IC Sockets Mfr 3M Series 8400 Package Tube Product Status Active Type PLCC Number of Positions or Pins (Grid) 84 (4 x 21) Pitch - Mating 0.050" (1.27mm) Contact Finish - Mating Tin Contact Finish ...
-
...Socket Tin Surface Mount Mfr 3M Series 8400 Product Status Active Type PLCC Number of Positions or Pins (Grid) 32 (2 x 7, 2 x 9) Pitch - Mating 0.050" (1.27mm) Contact Finish - Mating Tin Contact Finish Thickness - Mating 160.0µin (4.06µm) Contact Material - Mating Copper Alloy Mounting Type Surface Mount Features Closed Frame Termination Solder Pitch - Post 0.050" (1.27mm...
...Socket Tin Surface Mount Mfr 3M Series 8400 Product Status Active Type PLCC Number of Positions or Pins (Grid) 32 (2 x 7, 2 x 9) Pitch - Mating 0.050" (1.27mm) Contact Finish - Mating Tin Contact Finish Thickness - Mating 160.0µin (4.06µm) Contact Material - Mating Copper Alloy Mounting Type Surface Mount Features Closed Frame Termination Solder Pitch - Post 0.050" (1.27mm... more
Brand Name:3M
Model Number:8432-21B1-RK-TR
Place of Origin:USA
8432-21B1-RK-TR Dip IC Socket PLCC 32 Socket Tin Surface Mount
-
...Description: The Altera EP4CE40F23I7N is a Field Programmable Gate Array (FPGA) device from the Cyclone IV E family. It has a total of 328 I/O pins and is packaged in a 484-pin Fine-pitch Ball Grid Array (FBGA) package. Features: • High-performance, low-...
...Description: The Altera EP4CE40F23I7N is a Field Programmable Gate Array (FPGA) device from the Cyclone IV E family. It has a total of 328 I/O pins and is packaged in a 484-pin Fine-pitch Ball Grid Array (FBGA) package. Features: • High-performance, low-... more
Brand Name:Intel
Model Number:EP4CE40F23I7N
Minimum Order Quantity:1
EP4CE40F23I7N Field Programmable Transistor Array 200MHz 328 I/O 484FBGA Intel