...MK Phase Changing Materials For Cache Chips The TIC®800A series is a high-performance,cost-effective thermal interface material featuring a unique grain-oriented structure that enables precise conformity to device surfaces, thereby enhancing the thermal conduction path and transfer efficiency. When the temperature exceeds its phase transition point of 50°C, the material softens and undergoes phase change...
...MK Phase Changing Materials For Cache Chips The TIC®800A series is a high-performance,cost-effective thermal interface material featuring a unique grain-oriented structure that enables precise conformity to device surfaces, thereby enhancing the thermal conduction path and transfer efficiency. When the temperature exceeds its phase transition point of 50°C, the material softens and undergoes phase change... more
Laptop Silicone Phase Change Material CPU GPU Thermal Conductive 5.0W Phase Change Material The TIC™800G-ST series phase change thermal pad is a type of thermal Phase Change composite Material, specifically designed for applications requiring repeated ...
Laptop Silicone Phase Change Material CPU GPU Thermal Conductive 5.0W Phase Change Material The TIC™800G-ST series phase change thermal pad is a type of thermal Phase Change composite Material, specifically designed for applications requiring repeated ... more
TIC800G Manufacture Low Thermal Resistance 5.0W Low Melting Point Thermal Phase Changing Material TIC™800 series is low melting point thermal interface material. At 50℃,TIC™800 series begins tosoften and flow, filling the microscopic irregularities...
TIC800G Manufacture Low Thermal Resistance 5.0W Low Melting Point Thermal Phase Changing Material TIC™800 series is low melting point thermal interface material. At 50℃,TIC™800 series begins tosoften and flow, filling the microscopic irregularities... more
.... With a thermal conductivity of 7.5 W/mK, Tpcm™ 7000 is designed to enhance the cooling of the most rigorous thermal challenges in electronics. Softening between 50°C – 70°C, the initial pad thickness can ...
.... With a thermal conductivity of 7.5 W/mK, Tpcm™ 7000 is designed to enhance the cooling of the most rigorous thermal challenges in electronics. Softening between 50°C – 70°C, the initial pad thickness can ... more
